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1.35 A Low-Dropout Positive Voltage Regulators: High efficiency. Small size.


The LDI1117 series by Diotec are positive linear voltage regulators with low dropout and output currents of up to 1.35 A. They offer a typical voltage drop of 1.15 V at 1 A and can be operated at up to 20 V of input voltage (maximum rating).

Parts are available with adjustable output voltage, ranging from 1.25 V to 13.65 V and set-up by just two additional resistors. Further available are versions offering a fixed output voltage of 1.2 V, 1.5 V, 1.8 V, 2.5 V, 3.3 V or 5.0 V.

All versions feature integrated current limiting and thermal shut-down circuits, which prevent damage in case of overload conditions. Furthermore, its internal circuitry comprises of trimmed bandgap reference, ensuring the tight output voltage accuracy of 1% tolerance. Adding of 22 pF at the output is recommended to attenuate transient response and ensure stability.

They are offered in low profile and space saving packages like SOT-223, SO-8 and SOT-89. All these packages are totally lead-free and in full compliance to ROHS and REACH without any exemptions.


  • Low dropout: Typ. 1.15 V
  • Narrow Tolerance
  • Current Limiting & Thermal Overload Protection
  • Totally lead-free devices



  • Post regulators for switch mode power supplies
  • Battery Chargers
  • USB devices
  • Active SCSI termination regulator

Polarity Protection for Sensitive Automotive Electronics - Three common solutions and its benefits and drawbacks

Reverse Polarity Protection

Automotive electronic circuits must be protected against reverse polarity. Such events may occur e. g. during service time or jump-starts of the vehicle. For this purpose, hardware designers must take appropriate measures to keep automotive electronics unharmed after a reverse polarity event.
Diotec offers a wide range of AEC-Q101 qualified parts to avoid negative current flow. Our Application Note describes three of the most common solutions for reverse polarity protection, including benefits and drawbacks as well as recommended components.


Bidirectional Zener Diode in Single Package Outline: Two-in-one solution offers cost reduction and board space savings


The MM3BZ18 from Diotec combines two opposing 18 V Zener diodes on a single chip. It comes in the tiny SMD outline SOD-323, measuring only 2.5 mm x 1.25 mm and featuring a low profile height of just 1 mm. As such, it is ideally suited for very compact electronic assemblies.

Forming a bidirectional Zener diode, this part allows for positive and negative voltage clipping by just one component. It offers a sharp Zener voltage breakdown of nominal 18 V at 1 mA, a very low leakage current of less than 100 nA at 13 V and up to 200 mW of steady-state power dissipation.

Such device is ideally suited for AC voltage clipping circuits in motor control of brushless power tools, wide range input stages, smart home and IoT applications and further more. The two-in-one configuration enables design engineers to reduce component count, which not only saves board space but also costs for material and assembly.



  • Bidirectional configuration
  • Low leakage current
  • Board space savings
  • Cost reductions



  • Voltage Clipping Circuits
  • Wide Range Input Stages
  • Control of Brushless Power Tools
  • Offline Battery Chargers
  • Smart Home and IoT Applications

Application Note Reverse Polarity Protection

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-3G Schottky makes it possible:

Low forward voltage for fast charging and low leakage for long stand-by times.

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Cost Effective Yet Powerful Load Dump Protection Diodes: LDP01 and LDP02 in D²PAK offering 5 kW respectively 6.6 kW of peak pulse power


Especially in applications without centralized load dump protection, such as several motorbikes, a powerful yet cost effective load dump protection of distributed board electronics is desirable. The typically used package outline DO-218AB is offering a high performance, but is limited to load dump TVS devices and runs therefore in lower volumes only, causing higher device costs. The D²PAK offers a similar case outline but is an absolute industry standard package, used for high volume devices like Rectifiers and Schottkys. The LDP01 and LDP02 series by Diotec uses TVS chips capable for 5 kW respectively 6.6 kW of peak pulse power; both parts can pass load dump pulses according to ISO-16750-2 2012E – Table 5 Test A. First parts available are the LDP01-26AYD2-AQ, LDP01-28AYD2-AQ and LDP02-28AYD2-AQ, suitable for 12 V systems. Qualification according to AEC-Q101 is in progress and close to be completed. For general information about load dump protection diodes, please refer to our Application Note.


40 A/30 V Power MOSFET On Just 3.3 x 3.3 mm² DI040N03PT-AQ: Low Rds(on) in Tiny QFN3x3 Package with AEC-Q101 Qualification


The DI040N03PT-AQ comes in the tiny QFN3x3, a so called "leadless" power package where the connections are almost all "hidden" on the bottom side of the device. As such the board space requirement is no more than 3.3 x 3.3 mm². The low Rds(on) of this Power MOSFET device of typically 6 mOhm allows for a Drain current of up to 40 A at 25°C case temperature. Drain-Source voltage can be up to 30 V, with a single pulse avalanche capability of 100 mJ. Parts are not only suited for DC operation, but due to their low turn-on and -off characteristics also for high frequency switching. Typical applications are USB charger, power management units, battery powered devices, load switches and polarity protection. Beside the AEC-Q101 qualified part DI040N03PT-AQ also the commercial grade version DI040N03PT can be ordered. Samples are available from stock.


Correct Bending of Axial Lead Wires: Let us do it for you!

Correct Bending - flower bent down

Like flower stalks do not like to be buckled, also axial leads of semiconductor diodes require a certain, "sensitive" treatment, in order to reach a long lifetime of the part.

Axial lead devices are still used in huge volumes for many kinds of applications. Especially in (very) high voltage circuits they provide superior creepage and clearance over "small" SMD components. Before such parts can be assembled into the PCB, their lead wires need to be cut and bent for the desired length and raster. If this mechanical process is done in the wrong way, especially with no or no sufficient strain relief, a (pre-)damage of the semiconductor chip is likely. At best the part is broken immediately and can be replaced, but in worst case it will appear only later in the field with all the unwanted and unnecessary consequences. Our Application Note describes how the cutting and bending has to be done the right way, for high productivity and high reliability of the produced circuits.

And if you let us do the entire process for you, you can be assured that all components arrive in perfect shape and quality at your site. You just need to assemble it! Send your mechanical drawing or even a sketch of how you would like to have the leads formed to your authorized Diotec sales channel, and we will provide you our offer for this customer service.