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Bidirectional Zener Diode in Single Package Outline: Two-in-one solution offers cost reduction and board space savings
The MM3BZ18 from Diotec combines two opposing 18 V Zener diodes on a single chip. It comes in the tiny SMD outline SOD-323, measuring only 2.5 mm x 1.25 mm and featuring a low profile height of just 1 mm. As such, it is ideally suited for very compact electronic assemblies.
Forming a bidirectional Zener diode, this part allows for positive and negative voltage clipping by just one component. It offers a sharp Zener voltage breakdown of nominal 18 V at 1 mA, a very low leakage current of less than 100 nA at 13 V and up to 200 mW of steady-state power dissipation.
Such device is ideally suited for AC voltage clipping circuits in motor control of brushless power tools, wide range input stages, smart home and IoT applications and further more. The two-in-one configuration enables design engineers to reduce component count, which not only saves board space but also costs for material and assembly.
Features
- Bidirectional configuration
- Low leakage current
- Board space savings
- Cost reductions
Applications
- Voltage Clipping Circuits
- Wide Range Input Stages
- Control of Brushless Power Tools
- Offline Battery Chargers
- Smart Home and IoT Applications
Application Note Reverse Polarity Protection
- Products
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-3G Schottky makes it possible:
Low forward voltage for fast charging and low leakage for long stand-by times.
Cost Effective Yet Powerful Load Dump Protection Diodes: LDP01 and LDP02 in D²PAK offering 5 kW respectively 6.6 kW of peak pulse power
Especially in applications without centralized load dump protection, such as several motorbikes, a powerful yet cost effective load dump protection of distributed board electronics is desirable. The typically used package outline DO-218AB is offering a high performance, but is limited to load dump TVS devices and runs therefore in lower volumes only, causing higher device costs. The D²PAK offers a similar case outline but is an absolute industry standard package, used for high volume devices like Rectifiers and Schottkys. The LDP01 and LDP02 series by Diotec uses TVS chips capable for 5 kW respectively 6.6 kW of peak pulse power; both parts can pass load dump pulses according to ISO-16750-2 2012E – Table 5 Test A. First parts available are the LDP01-26AYD2-AQ, LDP01-28AYD2-AQ and LDP02-28AYD2-AQ, suitable for 12 V systems. Qualification according to AEC-Q101 is in progress and close to be completed. For general information about load dump protection diodes, please refer to our Application Note.
40 A/30 V Power MOSFET On Just 3.3 x 3.3 mm² DI040N03PT-AQ: Low Rds(on) in Tiny QFN3x3 Package with AEC-Q101 Qualification
The DI040N03PT-AQ comes in the tiny QFN3x3, a so called "leadless" power package where the connections are almost all "hidden" on the bottom side of the device. As such the board space requirement is no more than 3.3 x 3.3 mm². The low Rds(on) of this Power MOSFET device of typically 6 mOhm allows for a Drain current of up to 40 A at 25°C case temperature. Drain-Source voltage can be up to 30 V, with a single pulse avalanche capability of 100 mJ. Parts are not only suited for DC operation, but due to their low turn-on and -off characteristics also for high frequency switching. Typical applications are USB charger, power management units, battery powered devices, load switches and polarity protection. Beside the AEC-Q101 qualified part DI040N03PT-AQ also the commercial grade version DI040N03PT can be ordered. Samples are available from stock.
Correct Bending of Axial Lead Wires: Let us do it for you!
Like flower stalks do not like to be buckled, also axial leads of semiconductor diodes require a certain, "sensitive" treatment, in order to reach a long lifetime of the part.
Axial lead devices are still used in huge volumes for many kinds of applications. Especially in (very) high voltage circuits they provide superior creepage and clearance over "small" SMD components. Before such parts can be assembled into the PCB, their lead wires need to be cut and bent for the desired length and raster. If this mechanical process is done in the wrong way, especially with no or no sufficient strain relief, a (pre-)damage of the semiconductor chip is likely. At best the part is broken immediately and can be replaced, but in worst case it will appear only later in the field with all the unwanted and unnecessary consequences. Our Application Note describes how the cutting and bending has to be done the right way, for high productivity and high reliability of the produced circuits.
And if you let us do the entire process for you, you can be assured that all components arrive in perfect shape and quality at your site. You just need to assemble it! Send your mechanical drawing or even a sketch of how you would like to have the leads formed to your authorized Diotec sales channel, and we will provide you our offer for this customer service.
Small Signal Devices: Performance without Compromise
Small signal devices are semiconductor components found in almost every electronic circuit. They are used in a variety of applications such as analogue and digital broadcasting, logic ciruits, computing, controls and automation, processing "small signals" with short duration, low power and mostly high frequencies. The current market demand for portable digital communications, signal processing equipment and other handheld multimedia creates the necessity for miniaturized electronic components to enable slim and small designs, but without compromising in funcionality and performance.
Diotec offers a wide range of small signal components including high-speed Switching Diodes, Zener Diodes, ESD Protection Diodes, Voltage Regulators, Bipolar Transistors and MOSFETs. Package sizes are 0603, 1608, SOT-23, SOT-323, SOT-363, SOT-26, SOD-523, (Power)SOD-323, SOD-123(F/FL), SOD-106 and SOD-80C. With the exemption of the last two packages, all of these are totally free of lead (Pb), with other words fully RoHS compliant without any exemption. You will find more detailed infomation in our actual Application Note.
S8A to S8M Series: 8A Rectifier in SMD
Replacing through-hole bridge rectifiers by four single SMD dicretes is often limited by a too low forward surge current rating (Ifsm) of potential candidates. The S8A to S8M Series by Diotec offers a powerful solution in surface mount SMC package. Unlike similar parts made by competitors, these parts feature a comfortable Ifsm rating of up to 320 A at 50 Hz/10ms half sine waves, or even 350 A at 60 Hz/8.3 ms. This allows replacement of through-hole bridges and thus saving of assembly costs wherever a high surge current is required, while average output current is in a lower range. The average forward current of 8 A at maximum 100° C terminal temperature would allow to build an equivalent 16 A bridge by using four parts in bridge configuration.
At 500 W input power and 230 V mains, the rectifier stage is loaded just a bit higher than with 2 A. Inrush current limitation is however often reduced to an absolute minimum effort for cost savings, which in contrast requires a very high Ifsm rating of the input bridge. As such, SMD versions are often not suitable. The S8A to S8M Series is closing this gap. The K and M types having 800 V respectively 1000 V are for 230 V mains, while the G and J with 400 V and 600 V match to 110 V supplies. The lower reverse voltage types A to D with 50 V to 200 V can be used for polarity protection purposes where Schottkys are not suitable, e. g. due to low leakage current requirements.
Features
- Repetitive Peak Reverse Voltage of up to 1000 V
- Average Forward Current of 8 A
- Forward Surge Current of 320 A (50 Hz/10 ms), respectively 350 A (60 Hz/8.3 ms)
- DO-214AB / SMC package
- For automatic SMD assembly