Solder & Assembly Instructions

焊接和组装介绍

焊接配置的详细说明以及相关参考文件

焊接和组装介绍

详细信息

...包括有关可接受的焊接配置的建议,请在 此处 下载(以下为简短摘要)。建议的最小焊接点大小皆可在 此文件 中找到。

手动焊接/烙铁

若焊接时在低于推荐温度260摄氏度下操作时,焊接时间不能超过10秒。上述操作时间只适用于当焊接接头大于5毫米的时候。如果焊接接头小于5毫米,焊接时间则必须减少到3秒。

清洁

必须严格遵守清洁剂的使用指南(例如Zestron等)。

浸焊/波峰焊接

引脚产品:如果焊接时温度低于260摄氏度,焊接接头应该小于1.5毫米。

SMD产品:当SMD产品完全浸没焊料时,在260摄氏度下,焊接时间不能超过10秒。

回流焊接

回流焊接最大可容许的焊接温度为260摄氏度,对于SMC/DO-214AB封装峰值焊接时间不能超过5秒。焊接温度超过255摄氏度时,焊接不得超过30秒。对于更大的封装产品(例如D2PAK/TO-263),焊接时间必须减少,更多焊接相关信息请参考J-STD-020D.1说明。

螺丝封装

对于螺丝封装,须参考规格书中的最大允许安装扭矩。

散热片封装

在产品塑封体和散热片之间涂抹一层薄薄的散热膏,以提高产品塑封体与散热片之间的热阻。

引脚折弯

所有引脚的弯折需要应力释放。在折弯之前,引脚必须要固定以防止机械应力对产品塑封体内部结构造成挤压。

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